A lifetime assessment and prediction method for large area solder joints
نویسندگان
چکیده
منابع مشابه
Electromigration in Solder Joints and Solder Lines
Au (0.05 μm) 69.4 μm Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead...
متن کاملIntermetallics in Solder Joints
Introduction Intermetallic compounds (IMCs) are generally considered a bad thing in solder joints, though this is not always the case. Excessive IMCs in solder joints are a bad thing since they significantly alter both the composition and the mechanical performance of the solder joint. Interfacial IMC layers can be an indication of the quality of the solder joint and the lack of them would indi...
متن کاملThermal Fatigue Assessment of Lead-Free Solder Joints
In this paper the authors have investigated the thermal fatigue reliability of lead-free solder joints. They have focused their attention to the formation of the intermetallic compound and its effect on the initiation and propagation behaviors of fatigue cracks. Furthermore, they also studied the effect of voids in the solder joints on the fatigue reliability. An isothermal fatigue test method ...
متن کاملSolder Joints Detection Method Based on Surface Recovery
Machine vision has been widely used in various industrial productions. However, the study for solder joints detection is not enough. This paper presents a solder joints detection method based on surface recovery. For a single gray-scale image, using shape-from-shading (SFS) technology, the surface of the solder joints is recovered. According to the shape distribution, the quality of solder join...
متن کاملLifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling
0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.08.017 ⇑ Corresponding author at: STMicroelectronics, 16 7155, 37071 Tours Cedex 2, France. Tel.: +33 (0)2 47 01 34. E-mail address: [email protected] (S. Jacqu In this paper, a physical model is proposed to estimate the TRIAC solder joint fatigue during power cycling. The lifetime prediction is based on the fo...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Microelectronics Reliability
سال: 2020
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2020.113888